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It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications

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Electronic Packaging Material

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Product Details

Product Description:

Tungsten Copper Alloy WCu Base Flange Heat Sink

 

It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications

Features:

High thermal conductivity due to no sintering additives were used

Excellent hermeticity

Relatively small density

Stampable sheets available (Mo content not more than 75wt.%)

Semi-finished or finished (Ni/Au plated) parts available

Application:

It is suitable for manufacturing the molybdenum-copper alloy rod used as heat sink sealing material, aluminum oxide ceramic sealing material and structural material for military high-power microelectronic devices.

Specification:

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