Tantalum Sputtering Target
Yuxiang provides a wide selection of purity and shapes of Tantalum sputtering target to meet different requirements of customers. Compared to other deposition methods, sputtered films have a better adhesion on the substrate, and materials with very high melting points such as tantalum (melting point 2998°C) can be easily sputtered. Our products are engineered specifically to perform reliably in the deposition process with small average grain size and high purity & density.
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Product Description:
Yuxiang provides a wide selection of purity and shapes of Tantalum sputtering target to meet different requirements of customers. Compared to other deposition methods, sputtered films have a better adhesion on the substrate, and materials with very high melting points such as tantalum (melting point 2998°C) can be easily sputtered. Our products are engineered specifically to perform reliably in the deposition process with small average grain size and high purity & density.
Application:
Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal display screens, laser memory, electronic control devices,etc. It can also be used in glass coating field and applied to wear resistant materials, high temperature corrosion resistance, high-grade decorative products and other industries.
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