Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Large sized sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding which can repeatedly resist 850℃ heat shock
Tailorable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
This kind of composite is widely used in Semiconductor, RF, Microwave, Lager, High power Diode ,IC, Hermetic and Ceramic Packaging.