We manufacture W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu high performance electronic packaging materials, Tantalum, Niobium, Titanium, TZM, WNiFe, WNiCu and their alloys as a recognized leader in the deep processing industry.

We manufacture W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu high performance electronic packaging materials, Tantalum, Niobium, Titanium, TZM, WNiFe, WNiCu and their alloys as a recognized leader in the deep processing industry.

Yuxiang supplies high purity and density niobium and niobium alloys target for all PVD applications. Niobium sputtering targets can be produced in planar and rotatable configurations to fit customer specified backing plates or cups with either indium/tin or silver epoxy bonding.

Niobium Rod/Bar is worked from ingot to final diameter, forging, rolling, swaging, and drawing are used singularly or in combination to reach the desired size. Our niobium rod/bar has particularly low tolerances in terms of diameter, roundness and straightness.