Tungsten-copper material is a composite material made from tungsten and copper. It combines tungsten's low thermal expansion properties with copper's exceptional thermal conductivity. Moreover, its coefficient of thermal expansion, as well as its thermal and electrical performance, can be tailored by adjusting the material's composition. Tungsten-copper materials exhibit excellent thermal expansion compatibility when paired with ceramic, conductive, and metallic materials, making them ideal for applications in industries such as RF, microwave technology, high-power semiconductor packaging, and optical communications.

Product Features

1. Without adding sintering activation elements such as Fe and Co, it has managed to maintain high thermal conductivity.

2. Excellent airtightness.

3. Provide semi-finished products or finished products with Ni/Au plating on the surface.

4. Excellent dimensional control, surface finish, and flatness.

5. Full-process technical services before, during, and after sales.