Tungsten, with its unmatched extremely high melting point, density, and hardness, has become an indispensable key material for addressing extreme environments such as ultra-high temperatures, severe wear, and strong corrosion.

Tungsten heavy alloys (WNiFe and WNiCu) contain 80%–98% tungsten, along with small amounts of nickel, iron, and copper. After compaction and sintering, these tungsten-based metal alloys—like all others—begin as powders.

Product Category: Electronic Packaging Materials Tungsten-copper material is a composite material made from tungsten and copper. It combines tungsten's low thermal expansion properties with copper's exceptional high thermal conductivity. Moreover, its coefficient of thermal expansion and thermoelectric performance can be tailored by adjusting the material's composition. Tungsten-copper materials exhibit excellent thermal expansion compatibility when paired with ceramic, conductive, and metallic materials, making them ideal for applications in industries such as radio frequency, microwave technology, high-power semiconductor packaging, and optical communications.

Tungsten filament for increased creep resistance and meets stringent requirements for lifetime, light output, reliability and mechanical robustness.