It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications

Product Category: Electronic Packaging Materials Tungsten-copper material is a composite material made from tungsten and copper. It combines tungsten's low thermal expansion properties with copper's exceptional high thermal conductivity. Moreover, its coefficient of thermal expansion and thermoelectric performance can be tailored by adjusting the material's composition. Tungsten-copper materials exhibit excellent thermal expansion compatibility when paired with ceramic, conductive, and metallic materials, making them ideal for applications in industries such as radio frequency, microwave technology, high-power semiconductor packaging, and optical communications.

Diamond substrates can be used in thermal management components for optical communications, chips, laser diode arrays, 5G base stations, aerospace, and high-power electronic devices.

Diamond-Copper Heat Sink: Excellent thermal conductivity for efficient cooling. Wide Application Range: Suitable for electronics packaging, RF, and microwave devices.