It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications

Product Category: Electronic Packaging Materials Tungsten-copper material is a composite material made from tungsten and copper. It combines tungsten's low thermal expansion properties with copper's exceptional high thermal conductivity. Moreover, its coefficient of thermal expansion and thermoelectric performance can be tailored by adjusting the material's composition. Tungsten-copper materials exhibit excellent thermal expansion compatibility when paired with ceramic, conductive, and metallic materials, making them ideal for applications in industries such as radio frequency, microwave technology, high-power semiconductor packaging, and optical communications.

Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu、Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components