+
  • 20200622142943_4390.jpg
  • 20200622142943_1950.jpg
  • 20200622142943_7831.jpg
  • plpro20200610113422IUEBP.jpg
  • 20200622142943_9166.jpg
  • 20200622142943_9420.jpg

It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.

Keywords:

Electronic Packaging Material

Message

Prev

Next

Product Details

Product Description:

Tungsten Copper Alloy WCu Base Flange Heat Sink

 

It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.

Application:

This kind of alloy is extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Specification:

Tungsten Copper Alloy WCu Base Flange Heat Sink

Message Inquiry

Security verification
Submit