+
  • 20200622143617_2743.jpg
  • 20200622143617_9654.jpg
  • 20200622143617_5818.jpg
  • 20200622143617_9860.jpg
  • plpro20200610113420P6A4L.jpg
  • 20200622143617_9650.jpg
  • 20200622143617_5937.jpg

Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu、Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components

Keywords:

Electronic Packaging Material

Message

Prev

Next

Product Details

Product Description:

Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu、Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components

Features:

Large sized sheets available (length up to 400mm, width up to 200mm)

More easily to be stamped into components than CMC

Very strong interface bonding which can repeatedly resist 850℃ heat shock

Higher thermal conductivity and lower cost

No magnetism

Application:

Its expansion coefficient and thermal conductivity can be designed for use in rf, microwave and semiconductor high-power devices.

Specification:

Tungsten Copper Alloy WCu Base Flange Heat Sink

Message Inquiry

Security verification
Submit