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Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

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Electronic Packaging Material

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Product Details

Product Description:

Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

Features:

Large sized sheets available (length up to 400mm, width up to 200mm)

Can be stamped into components

Very strong interface bonding which can repeatedly resist 850℃ heat shock

Tailorable CTE matching that of semiconductor and ceramic materials

High thermal conductivity

No magnetism

Application:

This kind of composite is widely used in Semiconductor, RF, Microwave, Lager, High power Diode ,IC, Hermetic and Ceramic Packaging.

Specification:

Tungsten Copper Alloy WCu Base Flange Heat Sink

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